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    RF & Microwave PCBs

    TTM applications based approach provides innovative engineering and advanced process capabilities.

    From defense/aerospace electronics, medical devices and imaging, or complex telecommunications equipment, TTM supports a wide range of frequency bands (L, S, C, X, Ku, K, Ka, V, W). We have extensive experience with a wide range of low loss laminates and a total of over 70 resin systems.

    Our Field Applications Engineering team provides a long history of collaborative engineering support. Qualifications include MIL-PRF-31032, AS 9100, ITAR, IPC 6012 & IPC6018, NADCAP.

    Our Capabilities Include:

    Tight Etch Tolerances on Critical RF Features

    • +/- .0005" standard tolerance on etched features for unplated 0.5oz copper
    • Selective plated up layers allowing +/- .0005" etch tolerances
    • Exact registration/laser direct imaging
    • Front to back registration of etched cores to +/-.001"
    • Mixed Dielectric constructions
    • Buried / Blind / Microvia
    • Ormet interconnects
    • Multilevel cavity constructions
    • Optical mill / drill
    • Laser routing
    • Sequential lamination
    • Formed PCB'S
    • Plated edges

    Back Drill for Precision Stub Removal

    • Mechanical back-drilling (Minimal stub)
    • Laser drilling (No stub)
    • Laser modified controlled depth drill (Mechanical drill followed by laser cleanup, no stub)

    Hole Fill

    • Conductive, nonconductive, and partial hole fill options

    Thermal Solutions

    • Copper coins and slugs
    • Metal Core & Metal Back
    • Thermally conductive laminates
    • Heatsink assembly department to laminate heatsink or interface plates to the circuit boards

    Embedded Capabilities

    • Planar Resistors
      • Ohmega and Ticer
      • Screened Ink Resistors
    • Circulators
      • On board circuit
      • Embedded ferrites

    Surface Finishes

    • ENIG – electroless nickel, soft immersion gold – standard solder assemblies
    • ENEPIG - electroless nickel, electroless palladium, immersion gold
    • Hard and soft wirebondable gold
    • Immersion silver

    Assembly and Test

    • RF assembly of connector, surface mount component, drop-in cavity components, hand and automated solder assembly options
    • RF test center including 6 Network analyzers with combined frequency sweep coverage of 50MHz to 40GHz.
    • Custom anechoic boxes for antenna measurements
    • Switch matrix capability for multiple measurements between human interaction
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