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    Products and Services

    We offer a wide range of PCB products including conventional PCBs, HDI PCBs, flexible PCBs, rigid-flex PCBs, backplane assemblies, and IC substrates. We also offer value-added services to support our customers' needs.

    TTM services also include Electro-Mechanical Solutions (E-MS). Our products in this area include sheet metal design and fabrication, backplane assembly, system integration, test and logistics for a complete solution supporting sub-system and full system integration requirements.

    Printed Circuit Board Fabrication

    Conventional PCB

    • Multilayer up to 60+ layers
    • Embedded passives
    • Heavy copper up to 10 oz.
    • Over 50 UL approved laminates
    • Thickness up to 0.450"
    • Thin core dielectrics
    • Dimensions up to 30" x 54"
    • Mixed dielectrics

    HDI

    • Up to 12L "anylayer" stacked uVia Structure
    • 1.6 / 2.0 mil line / space
    • Wide material and surface finish selections
    • 14 mil, 6L ultra thin structure
    • 3/7 mil uVia / Pad size
    • 0.4 mm pitch BGA with 2 traces fanout
    • Embedded, distributed and discrete passive components

    Flex & Rigid-Flex

    • Type 2, 3 and 4 (double sided, multilayer and rigid-flex)
    • 30+ layers
    • Dimensions up to 24" x 48"
    • Acrylic, epoxy and adhesive-less polyimide flex materials
    • Over 50 rigid material options
    • Thickness up 0.300"
    • Bikini cut, bookbinder and loose leaf construction
    • Combination surface finishes
    • Epoxy fillet

    RF & Microwave

    • High frequency / bandwidth designs
    • Planar and screened resistors
    • Dimensions up to 24" x 48"
    • Mixed dielectrics (hybrids)
    • Dielectric foam
    • Conductive paste
    • Plated cavities
    • Formed (conformal) PCBs
    • Optical machining

    Thermal Management

    • Passive and active designs
    • Buried metal core constructions
    • Externally mounted heatsinks
    • Epoxy and B-stage films
    • Thermal & conductive bonding
    • Aluminum & copper base materials
    • Various surface finishes
    • In-house milling and bonding

    IC Substrate

    • 2,4,6 Layers (2+2+2 stacked via)
    • BT material
    • Wire bonding (ENEPIG, Soft gold, Hard gold)
    • Type: SIP,CSP,BOC & FC package
    • Fine trace width/space 25/25um
    • Thin board: 130um(2L), 170um(4L)
    • Flip chip C4 pad

    Custom Assembly

    Backplanes

    • Dimensions up to 28" x 52"
    • Thickness up to 0.400"
    • Custom and Industry Standard
    • Press-fit (compliant a€“pin)
    • Surface mount (chip, QFP, BGA)
    • Wave / selective solder
    • AOI & X-ray inspection
    • Level 2, 3 & 4 testing
    • Conformal coating

    Flex & Rigid-Flex

    • Dimensions up to 22" x 52"
    • Passive & active components
    • Press-fit (compliant-pin)
    • Surface mount (chip, QFP, BGA)
    • AOI & X-ray inspection
    • Level 2,3, & 4 testing

    RF & Microwave

    • Dimensions up to 22" x 34"
    • Blind via, surface mount, thru-hole
    • 1-piece hermetic GPO and GPPO
    • X-ray inspection
    • RF testing (20+ GHz)

    Integrated Assembly

    • Card cage through cabinet
    • Backplanes & Midplanes
    • Harnessing & cabling
    • Power supplies & fan trays
    • Peripherals & controllers
    • I/O interfaces
    • Functional testing
    • Mil & Aero conduction cooled
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